CXD2027R Ver la hoja de datos (PDF) - Sony Semiconductor

Número de pieza

componentes Descripción

fabricante

CXD2027R

DBS Audio Signal Processor

Sony Semiconductor 

Package Outline

Unit: mm

CXD2027Q

51

52

64PIN QFP(PLASTIC)

23.9 ± 0.4

+ 0.4

20.0 – 0.1

33

32

+ 0.1

0.15 – 0.05

0.15

64

1

1.0

20

19

+ 0.15

0.4 – 0.1

+ 0.35

2.75 – 0.15

± 0.12 M

+ 0.2

0.1 – 0.05

CXD2027R

SONY CODE

EIAJ CODE

JEDEC CODE

QFP–64P–L01

∗ QFP064–P–1420

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

EPOXY RESIN

SOLDER/PALLADIUM

PLATING

COPPER /42 ALLOY

PACKAGE WEIGHT

1.5g

80PIN LQFP (PLASTIC)

14.0 ± 0.2

∗ 12.0 ± 0.1

60

41

61

40

A

80

1

0.5 ± 0.08

+ 0.08

0.18 – 0.03

0.1 ± 0.1

21

(0.22)

20

+ 0.2

1.5 – 0.1

+ 0.05

0.127 – 0.02

0.1

0° to 10°

NOTE: Dimension “∗” does not include mold protrusion.

SONY CODE

EIAJ CODE

JEDEC CODE

DETAIL A

LQFP-80P-L01

∗QFP080-P-1212-A

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

EPOXY / PHENOL RESIN

SOLDER PLATING

LEAD MATERIAL

42 ALLOY

PACKAGE WEIGHT

0.5g

– 32 –

CXD2027Q/R

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