TZA3013AU Ver la hoja de datos (PDF) - Philips Electronics
Número de pieza
componentes Descripción
fabricante
TZA3013AU Datasheet PDF : 16 Pages
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Philips Semiconductors
SDH/SONET STM16/OC48
transimpedance amplifier
Product specification
TZA3013A; TZA3013B
DATA SHEET STATUS
DATA SHEET STATUS
Objective specification
PRODUCT
STATUS
Development
Preliminary specification Qualification
Product specification
Production
DEFINITIONS (1)
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
BARE DIE DISCLAIMER
All die are tested and are guaranteed to comply with all
data sheet limits up to the point of wafer sawing for a
period of ninety (90) days from the date of Philips' delivery.
If there are data sheet limits not guaranteed, these will be
separately indicated in the data sheet. There is no post
waffle pack testing performed on individual die. Although
the most modern processes are utilized for wafer sawing
and die pick and place into waffle pack carriers, Philips
Semiconductors has no control of third party procedures in
the handling, packing or assembly of the die. Accordingly,
Philips Semiconductors assumes no liability for device
functionality or performance of the die or systems after
handling, packing or assembly of the die. It is the
responsibility of the customer to test and qualify their
application in which the die is used.
2001 Feb 26
15
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