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TSOP6930 Ver la hoja de datos (PDF) - Vaishali Semiconductor

Número de pieza
componentes Descripción
fabricante
TSOP6930
VAISH
Vaishali Semiconductor 
TSOP6930 Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
TSOP69..
Vishay Semiconductors
Package Dimensions in mm
16629
Assembly Instructions
Reflow Soldering
• Reflow soldering must be done within 72 hours
stored under max. 30 °C, 60 % RH after opening
envelop
• Recommended soldering paste (composition: SN 63
%, Pb 37 %) Melting temperature 178 °C to 192 °C
• Apply solder paste to the specified soldering pads,
by using a dispenser or by screen printing.
www.vishay.com
6
Document Number 84687
Rev. 1.0, 01-Mar-05

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