TJA1040 Ver la hoja de datos (PDF) - Philips Electronics

Número de pieza

componentes Descripción

fabricante

TJA1040

High speed CAN transceiver

Philips Electronics 

Philips Semiconductors

High speed CAN transceiver

Product specification

TJA1040

BONDING PAD LOCATIONS

SYMBOL

TXD

GND

VCC

RXD

SPLIT

CANL

CANH

STB

PAD

1

2

3

4

5

6

7

8

COORDINATES(1)

x

y

119.5

648.5

1 214.25

1 635.25

1 516.5

990.5

530.25

113.75

114.5

85

114.5

114.5

1 275

1 273.75

1 273.75

1 246

Note

1. All x/y coordinates represent the position of the centre

of each pad (in µm) with respect to the left hand

bottom corner of the top aluminium layer (see Fig.9).

handbook, halfpage 8

7

6

5

TJA1040U

test pad 1

test pad 2

x

01

0

2

3

4

MBL584

y

The backside of the bare die must be connected to ground.

Fig.9 Bonding pad locations.

2003 Oct 14

11

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