TDA7563PDTR Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
fabricante
TDA7563PDTR Datasheet PDF : 29 Pages
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TDA7563PD
5
Thermal protection
Thermal protection
Thermal protection is implemented through thermal foldback (Figure 26).
Thermal foldback begins limiting the audio input to the amplifier stage as the junction
temperatures rise above the normal operating range. This effectively limits the output power
capability of the device thus reducing the temperature to acceptable levels without totally
interrupting the operation of the device.
The output power will decrease to the point at which thermal equilibrium is reached.
Thermal equilibrium will be reached when the reduction in output power reduces the
dissipated power such that the die temperature falls below the thermal foldback threshold.
Should the device cool, the audio level will increase until a new thermal equilibrium is
) reached or the amplifier reaches full power. Thermal foldback will reduce the audio output
t(s level in a linear manner.
c Three Thermal warning are available through the I2C bus data.
du Figure 26. Thermal foldback diagram
Pro t(s) Vout
TH. WARN. TH. WARN. TH. WARN.
ON
ON
ON
bsolete Produc Vout
125°
140°
155°
TH. SH.
START
TH. SH. Tj ( °C)
END
OObbssoolleettee PPrroodduucctt((ss)) -- OObsolete CDout
< TSD
> TSD (with same input
signal)
Tj ( °C)
Tj ( °C)
19/29
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