SM15Txx
Fig. 4a : Capacitance versus reverse applied
voltage for unidirectional types (typical values).
Fig. 4b : Capacitance versus reverse applied
voltage for bidirectional types (typical values).
Fig. 5 : Peak forward voltage drop versus peak
forward current (typical values for unidirectional
types).
Fig. 6 : Transient thermal impedance junc-
tion-ambient versus pulse duration.
Mounting on FR4 PC Board with recommended
pad layout.
Fig. 7 : Relative variation of leakage current
versus junction temperature.
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