SIM3C134 Ver la hoja de datos (PDF) - Silicon Laboratories

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SIM3C134

High-Performance, Low-Power, 32-Bit Precision32™ MCU Family with up to 256 kB of Flash

Silicon Laboratories 

SiM3C1xx

6.7.1. TQFP-64 Solder Mask Design

All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad

is to be 60 µm minimum, all the way around the pad.

6.7.2. TQFP-64 Stencil Design

1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure

good solder paste release.

2. The stencil thickness should be 0.125 mm (5 mils).

3. The ratio of stencil aperture to land pad size should be 1:1 for all pads.

6.7.3. TQFP-64 Card Assembly

1. A No-Clean, Type-3 solder paste is recommended.

2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body

Components.

Rev.1.0

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