S29GL512P10FFI Ver la hoja de datos (PDF) - Spansion Inc.

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S29GL512P10FFI

S29GL-P MirrorBit® Flash Family

Spansion Inc. 

Data Sheet

4.4 TS056—56-Pin Standard Thin Small Outline Package (TSOP)

Figure 4.4 56-Pin Thin Small Outline Package (TSOP), 14 x 20 mm

PACKAGE

TS 56

JEDEC

MO-142 (B) EC

SYMBOL MIN. NOM.

MAX.

A

---

---

1.20

A1

0.05

---

0.15

A2

0.95

1.00

1.05

b1

0.17

0.20

0.23

b

0.17

0.22

0.27

c1

0.10

---

0.16

c

0.10

---

0.21

D

19.80 20.00

20.20

D1

18.30 18.40

18.50

E

13.90 14.00

14.10

e

0.50 BASIC

L

0.50

0.60

0.70

O

0˚

-

8˚

R

0.08

---

0.20

N

56

NOTES:

1 CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).

(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)

2 PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).

3 TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS

DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE

LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.

4 DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE

MOLD PROTUSION IS 0.15 mm PER SIDE.

5 DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE

DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b

DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN

PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.

6 THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN

0.10 mm AND 0.25 mm FROM THE LEAD TIP.

7 LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE

SEATING PLANE.

8 DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.

3160\38.10A

16

S29GL-P MirrorBit® Flash Family

S29GL-P_00_A14 October 22, 2012

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