PKC-136 Ver la hoja de datos (PDF) - STMicroelectronics
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PKC-136 Datasheet PDF : 5 Pages
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PKC-136
Fig. 5: Thermal resistance junction to ambient
versus copper surface under each lead.
Rth(j-a)
110
100
Lleads=10mm
90
80
70
60
50
40
30
20
10
S(cm²)
0
0
1
2
3
4
5
6
7
8
9
10
Fig. 6-1: Reverse leakage current versus reverse
voltage applied (typical values, for Transil).
IR(µA)
1.E+00
1.E-01
1.E-02
Tj=150°C
Tj=125°C
Tj=100°C
1.E-03
1.E-04
Tj=25°C
1.E-05
VR(V)
1.E-06
10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Fig. 6-2: Reverse leakage current versus reverse
voltage applied (typical values, for diode).
IR(µA)
1.E+02
1.E+01
1.E+00
Tj=150°C
Tj=125°C
Tj=100°C
1.E-01
1.E-02
Tj=25°C
1.E-03
0
VR(V)
50 100 150 200 250 300 350 400 450 500 550 600 650 700
Fig. 7: Transient peak forward voltage versus
dIF/dt (90% confidence).
VFP(V)
50
IF=3A
45
Tj=125°C
40
35
30
25
20
15
10
5
dIF/dt(A/µs)
0
0
50 100 150 200 250 300 350 400 450 500
Fig. 8: Clamping voltage versus peak pulse
current (maximum values).
Ipp(A)
10.0
tp<500ns
Fig. 9: Junction capacitance versus reverse
voltage applied on clamping characteristic (typical
values).
C(pF)
100
F=1MHz
Vosc =30mVRMS
Tj=25°C
Tj=25°C
Tj=125°C
1.0
Vcl(V)
0.1
160 165 170 175 180 185 190 195 200 205 210 215 220
10
1
4/5
VR(V)
10
100
1000
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