4134-EK Ver la hoja de datos (PDF) - Peregrine Semiconductor Corp.
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4134-EK Datasheet PDF : 9 Pages
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Figure 3. Pin Configuration (Top View)
IF1 1
6 IF2
GND 2
5 GND
LO 3
4 RF
PE4134
Table 2. Pin Descriptions
Pin
Pin
No. Name
Description
1
IF1 IF differential output
Ground connections for Mixer. Traces
should be physically short and connect
2
GND
immediately to ground plane for best
performance. The exposed solder pad
must also be soldered to the ground plane
for best performance.
3
LO LO Input
4
RF RF Input
Ground connections for Mixer. Traces
should be physically short and connect
5
GND
immediately to ground plane for best
performance. The exposed solder pad
must also be soldered to the ground plane
for best performance.
6
IF2 IF differential output
PE4134
Product Specification
Table 3. Absolute Maximum Ratings
Symbol Parameter/Conditions Min Max Units
TST
Storage temperature range -65 150 °C
TOP
Operating temperature
range
-40 85
°C
PLO
LO input power
20 dBm
PRF
RF input power
12 dBm
VESD
ESD Sensitive Device
250
V
Absolute Maximum Ratings are those values
listed in the above table. Exceeding these values
may cause permanent device damage.
Functional operation should be restricted to the
limits in the DC Electrical Specifications table.
Exposure to absolute maximum ratings for
extended periods may affect device reliability.
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS™ device, observe
the same precautions that you would use with
other ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the rating specified.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS™
devices are immune to latch-up.
©2006 Peregrine Semiconductor Corp. All rights reserved.
Page 2 of 9
Document No. 70-0087-03 │ UltraCMOS™ RFIC Solutions
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