Philips Semiconductors
4-digit duplex LCD car clock
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
Product specification
PCF1179C
y
A2/ADEG1
AM/PM
BP2
BP1
2.92 mm
S1
DATA
OSC IN
OSC OUT
0
0
PCF1179CU
1.92 mm
G3/AD3
B3/C3
F4/E4
G4/D4
B4/C4
S2
SEL
FLASH
x
MSB233
Chip area: 5.61 mm2.
Bonding pad dimensions: 110 µm × 110 µm.
Chip thickness: 381 ±25 µm.
Fig.7 Bonding pad locations, PCF1179CU; 28 terminals.
1997 Apr 16
11