Philips Semiconductors
10. Soldering
PBSS3515E
15 V, 0.5 A PNP low VCEsat (BISS) transistor
2.20
0.60 1.10
0.70
2.00 0.85
2
3
1
0.60
(3x)
1.90
Dimensions in mm
Fig 12. Reflow soldering footprint
3.80
3.30
0.70
1.50
0.50
(3x)
MSA438
2.85 1.50
2.10
0.80
solder lands
solder resist
occupied area
solder paste
solder lands
solder resist
occupied area
MSA418
preferred transport direction during soldering
Dimensions in mm
Fig 13. Wave soldering footprint
9397 750 14878
Product data sheet
Rev. 01 — 18 April 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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