PALC22V10D-10PC Ver la hoja de datos (PDF) - Cypress Semiconductor
Número de pieza
componentes Descripción
fabricante
PALC22V10D-10PC Datasheet PDF : 12 Pages
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Ordering Information
ICC tPD
tS
tCO
(mA) (ns) (ns) (ns)
Ordering Code
130 7.5 5
5 PALC22V10D-7JC
PALC22V10D-7PC
90 10 6
7 PALC22V10D-10JC
PALC22V10D-10PC
150 10 6
7 PALC22V10D-10JI
PALC22V10D-10PI
150 10 6
7 PALC22V10D-10DMB
PALC22V10D-10KMB
PALC22V10D-10LMB
90 15 7.5 10 PALC22V10D-15JC
PALC22V10D-15PC
120 15 7.5 10 PALC22V10D-15JI
PALC22V10D-15PI
120 15 7.5 10 PALC22V10D-15DMB
PALC22V10D-15KMB
PALC22V10D-15LMB
90 25 15 15 PALC22V10D-25JC
PALC22V10D-25PC
120 25 15 15 PALC22V10D-25JI
PALC22V10D-25PI
120 25 15 15 PALC22V10D-25DMB
PALC22V10D-25KMB
PALC22V10D-25LMB
MILITARY SPECIFICATIONS
Group A Subgroup Testing
DC Characteristics
Parameter
VOH
VOL
VIH
VIL
IIX
IOZ
ICC
Subgroups
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
PALC22V10D
Package
Name
J64
P13
J64
P13
J64
P13
D14
K73
L64
J64
P13
J64
P13
D14
K73
L64
J64
P13
J64
P13
D14
K73
L64
Package Type
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
24-Lead (300-Mil) CerDIP
24-Lead Rectangular Cerpack
28-Square Leadless Chip Carrier
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
24-Lead (300-Mil) CerDIP
24-Lead Rectangular Cerpack
28-Square Leadless Chip Carrier
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
24-Lead (300-Mil) CerDIP
24-Lead Rectangular Cerpack
28-Square Leadless Chip Carrier
Operating
Range
Commercial
Commercial
Industrial
Military
Commercial
Industrial
Military
Commercial
Industrial
Military
Switching Characteristics
Parameter
Subgroups
tPD
9, 10, 11
tCO
9, 10, 11
tS
9, 10, 11
tH
9, 10, 11
Document #: 38-00185-H
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