AD8509ARU Ver la hoja de datos (PDF) - Analog Devices
Número de pieza
componentes Descripción
fabricante
AD8509ARU Datasheet PDF : 12 Pages
| |||
OUTLINE DIMENSIONS
12.60
12.50
12.40
48
1
PIN 1
25
6.20
6.10
6.00
8.10 BSC
24
1.20 MAX
0.15
0.05
0.50
BSC
0.27 SEATING
0.17
PLANE
8°
0.20
0°
0.09
COMPLIANT TO JEDEC STANDARDS MO-153-ED
Figure 14. 48-Lead Thin Shrink Small Outline Package [TSSOP]
(RV-48)
Dimensions shown in millimeters
AD8509/AD8511
0.75
0.60
0.45
7.00
BSC SQ
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
37
36
0.30
0.23
0.18
48
1
PIN 1
INDICATOR
TOP
VIEW
6.75
BSC SQ
EXPOSED
PAD
(BOTTOM VIEW)
5.25
5.10 SQ
4.95
1.00 12° MAX
0.85
0.80
SEATING
PLANE
0.50
0.40
25
12
0.30
24
13
0.80 MAX
0.65 TYP
0.50 BSC
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
5.50
REF
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
Figure 15. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
7 mm x 7 mm Body, Very Thin Quad
(CP-48-1)
Dimensions shown in millimeters
0.25 MIN
ORDERING GUIDE
Model1
AD8509ARU-REEL
AD8509ARUZ-REEL2
AD8511ARU-REEL
AD8511ARUZ-REEL2
AD8511ACPZ-REEL2
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
48-Lead Thin Shrink Small Outline Package [TSSOP]
48-Lead Thin Shrink Small Outline Package [TSSOP]
48-Lead Thin Shrink Small Outline Package [TSSOP]
48-Lead Thin Shrink Small Outline Package [TSSOP]
48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Package Option
RV-48
RV-48
RV-48
RV-48
CP-48-1
1 All models only available in 2,500-piece reels.
2 Z = Pb-free part.
Rev. C | Page 9 of 12
Share Link: 