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NCP693HMN25TCG(2009) Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza
componentes Descripción
fabricante
NCP693HMN25TCG
(Rev.:2009)
ON-Semiconductor
ON Semiconductor 
NCP693HMN25TCG Datasheet PDF : 12 Pages
First Prev 11 12
NCP693
PACKAGE DIMENSIONS
UDFN6, 1.8x2, 0.5P
CASE 517BA01
ISSUE A
D
A
B
PIN ONE
ÍÍÍ LOCATION
ÍÍÍÍÍÍ 2X
0.10 C
E
2X
0.10 C
TOP VIEW
DETAIL B
A3
0.05 C
A
0.05 C
NOTE 4
A1
SIDE VIEW
b1
DETAIL A
D2
1
3
6X L
EXPOSED Cu
MOLD CMPD
ÇÉÉÇÉÉ DETAIL B
OPTIONAL
CONSTRUCTIONS
L
L
L1
DETAIL A
OPTIONAL
CONSTRUCTIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.15 AND 0.20mm FROM
THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.50 0.60
A1 0.00 0.05
A3
0.20 REF
b 0.15 0.30
b1 0.20 0.40
D
1.80 BSC
D2 1.50 1.70
E
2.00 BSC
E2 0.90 1.10
e
0.50 BSC
K 0.20 ---
L 0.15 0.35
L1 --- 0.10
C
SEATING
PLANE
RECOMMENDED
MOUNTING FOOTPRINT*
5X 0.25
1.70
2X E2
6X 0.48
1.10 2.30
K
6
e
4
5X b
0.10 C A B
0.05 C NOTE 3
BOTTOM VIEW
1
0.35
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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12
NCP693/D

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