MCP73832-4ATI Ver la hoja de datos (PDF) - Microchip Technology

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MCP73832-4ATI

Miniature Single-Cell, Fully Integrated Li-Ion,Li-Polymer Charge Management Controllers

Microchip Technology 

MCP73831/2

8-Lead Plastic Dual-Flat, No-Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated

D

E

b

K

p

n

L

E2

PIN 1

ID INDEX

AREA

(NOTE 1)

TOP VIEW

EXPOSED

METAL

PAD

(NOTE 2)

DETAIL

ALTERNATE

CONTACT

CONFIGURATION

21

D2

BOTTOM VIEW

A1 A

EXPOSED

TIE BAR

A3

(NOTE 3)

Units

INCHES

Number of Pins

Pitch

Dimension Limits

n

e

MIN

NOM

MAX

8

.020 BSC

Overall Height

Standoff

Contact Thickness

Overall Length

A

.031

.035

.039

A1

.000

.001

.002

A3

.008 REF.

D

.079 BSC

Overall Width

Exposed Pad Length

Exposed Pad Width

E

.118 BSC

D2

.051

–

.069

E2

.059

–

.075

Contact Length §

L

Contact-to-Exposed Pad

§

K

.012

.008

.016

–

.020

–

Contact Width

b

.008

.010

.012

* Controlling Parameter

** Not within JEDEC parameters

§ Significant Characteristic

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Exposed pad may vary according to die attach paddle size.

3. Package may have one or more exposed tie bars at ends.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

REF: Reference Dimension, usually without tolerance, for information purposes only.

See ASME Y14.5M

JEDEC Equivalent MO-229 VCED-2

DWG No. C04-123

MILLIMETERS*

MIN

NOM

8

0.50 BSC

0.80

0.90

0.00

0.02

0.20 REF.

2.00 BSC

3.00 BSC

1.30**

–

1.50**

–

0.30

0.40

0.20

–

0.20

0.25

MAX

1.00

0.05

1.75

1.90

0.50

–

0.30

Revised 09-12-05

DS21984B-page 16

© 2006 Microchip Technology Inc.

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