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MCP617T Ver la hoja de datos (PDF) - Microchip Technology

Número de pieza
componentes Descripción
fabricante
MCP617T
Microchip
Microchip Technology 
MCP617T Datasheet PDF : 38 Pages
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6.0 PACKAGING INFORMATION
6.1 Package Marking Information
8-Lead MSOP
XXXXXX
YWWNNN
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
NNN
MCP616/7/8/9
Example:
616I
812256
Examples:
MCP616
I/P256
0812
OR
MCP616
I/P e^^3 256
0812
Examples:
MCP616
I/SN0812
256
OR
MCP616I
SN^e^3 0812
256
Legend:
XX...X
Y
YY
WW
NNN
e3
*
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2008 Microchip Technology Inc.
DS21613C-page 23

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