MC100H644FN Ver la hoja de datos (PDF) - ON Semiconductor
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fabricante
MC100H644FN Datasheet PDF : 6 Pages
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−L−
20
MC10H644, MC100H644
−N−
Y BRK
−M−
PACKAGE DIMENSIONS
PLCC−20
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775−02
ISSUE D
B 0.007 (0.180) M T L−M S N S
U 0.007 (0.180) M T L−M S N S
D
Z
1
V
W
D
X
VIEW D−D
G1 0.010 (0.250) S T L−M S N S
A 0.007 (0.180) M T L−M S N S
Z
R 0.007 (0.180) M T L−M S N S
H 0.007 (0.180) M T L−M S N S
C
E
G
G1
0.010 (0.250) S T L−M S
0.004 (0.100)
J −T− SEATING
PLANE
VIEW S
NS
K1
K
F
VIEW S
0.007 (0.180) M T L−M S N S
NOTES:
1. DATUMS −L−, −M−, AND −N− DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM −T−, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
INCHES
DIM MIN MAX
A 0.385 0.395
B 0.385 0.395
C 0.165 0.180
E 0.090 0.110
F 0.013 0.019
G 0.050 BSC
H 0.026 0.032
J 0.020 −−−
K 0.025 −−−
R 0.350 0.356
U 0.350 0.356
V 0.042 0.048
W 0.042 0.048
X 0.042 0.056
Y −−− 0.020
Z
2 _ 10_
G1 0.310 0.330
K1 0.040 −−−
MILLIMETERS
MIN MAX
9.78 10.03
9.78 10.03
4.20 4.57
2.29 2.79
0.33 0.48
1.27 BSC
0.66 0.81
0.51 −−−
0.64 −−−
8.89 9.04
8.89 9.04
1.07 1.21
1.07 1.21
1.07 1.42
−−− 0.50
2 _ 10 _
7.88 8.38
1.02 −−−
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