MC100E167FN Ver la hoja de datos (PDF) - ON Semiconductor
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MC100E167FN Datasheet PDF : 8 Pages
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MC10E167, MC100E167
Table 7. 100E SERIES NECL DC CHARACTERISTICS VCCx = 0 V; VEE = −5.0 V (Note 7)
0°C
25°C
85°C
Symbol
Characteristic
Min Typ Max Min Typ Max Min Typ Max Unit
IEE
Power Supply Current
VOH
Output HIGH Voltage (Note 8)
VOL
Output LOW Voltage (Note 8)
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
IIH
Input HIGH Current
IIL
Input LOW Current
94
113
94
113
108 130 mA
−1025 −950 −880 −1025 −950 −880 −1025 −950 −880 mV
−1810 −1705 −1620 −1810 −1745 −1620 −1810 −1740 −1620 mV
−1165 −1025 −880 −1165 −1025 −880 −1165 −1025 −880 mV
−1810 −1645 −1475 −1810 −1645 −1475 −1810 −1645 −1475 mV
150
150
150 mA
0.5 0.3
0.5 0.25
0.5 0.2
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
7. Input and output parameters vary 1:1 with VCC. VEE can vary −0.46 V / +0.8 V.
8. Outputs are terminated through a 50 W resistor to VCC − 2.0 V.
Table 8. AC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = −5.0 V (Note 9)
0°C
25°C
Symbol
Characteristic
Min Typ Max Min Typ Max Min
fMAX
tPLH
tPHL
Maximum Toggle Frequency
Propagation Delay to Output
1000 1400
1000 1400
1000
Clk, MR 650 850 1050 650 850 1050 650
ts
Setup Time
D 100 − 50
100 − 50
100
SEL 275 125
275 125
275
th
Hold Time
D 300 50
300 50
300
SEL 75 −125
75 −125
75
tRR
Reset Recovery Time
750 550
750 550
750
tPW
Minimum Pulse Width
Clk, MR 400
400
400
tSKEW
tJITTER
tr
tf
Within-Device Skew (Note 10)
Random Clock Jitter (RMS)
Rise/Fall Times
(20 - 80%)
75
75
<1
<1
300 450 800 300 450 800 300
85°C
Typ
1400
850
− 50
125
50
−125
550
75
<1
450
Max
1050
Unit
MHz
ps
ps
ps
ps
ps
ps
ps
ps
800
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. 10 Series: VEE can vary −0.46 V / +0.06 V.
100 Series: VEE can vary −0.46 V / +0.8 V.
10. Within-device skew is defined as identical transitions on similar paths through a device.
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