Ultra-Efficient Negative Charge-Pump LED
Driver with Dual LDOs in 3mm x 3mm Thin QFN
resistance and to route heat away from the device. The
exposed paddle lowers the thermal resistance of the
package by providing a direct-heat conduction path
from the die to the printed circuit board (PCB). Connect
the exposed paddle to the GND plane directly under
the IC, but do not rely on EP for ground functions. For
good thermal dissipation, solder the exposed paddle to
the power ground plane. Refer to the MAX8822 evalua-
tion kit data sheet for an example PCB layout.
PROCESS: BiCMOS
Chip Information
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