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MAX16928(2011) Ver la hoja de datos (PDF) - Maxim Integrated

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MAX16928 Datasheet PDF : 20 Pages
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MAX16928
Automotive TFT-LCD Power Supply with Boost
Converter and Gate Voltage Regulators
Layout Considerations
Careful PCB layout is critical in achieving stable and
optimized performance. Follow these guidelines for good
PCB layout:
1) Place decoupling capacitors as close as possible to
the device. Connect the power ground planes and the
analog ground plane together at one point close to the
device.
2) Connect input and output capacitors to the power
ground planes; connect all other capacitors to the
analog ground plane.
3) Keep the high-current paths as short and wide as
possible. Keep the path of switching currents short.
4) Place the feedback resistors as close as possible to
the device. Connect the negative end of the resistive
divider and the compensation network to the analog
ground plane.
5) Route the high-speed switching node LXB and LXP
away from sensitive analog nodes (FB, FBP, FBGH,
FBGL, and REF).
Refer to the MAX16928 Evaluation Kit data sheet for a
recommended PCB layout.
PART
TEMP RANGE
MAX16928AGUP/V+
-40°C to +105°C
MAX16928BGUP/V+
-40°C to +105°C
MAX16928CGUP/V+
-40°C to +105°C
MAX16928DGUP/V+
-40°C to +105°C
/V denotes an automotive qualified part.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
REGULATOR VREG
(V)
3.3
1.8
3.3
1.8
Ordering Information
BOOST ILIM
(A)
1.5
1.5
0.75
0.75
PIN-PACKAGE
20 TSSOP-EP*
20 TSSOP-EP*
20 TSSOP-EP*
20 TSSOP-EP*
PROCESS: BiCMOS
Chip Information
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
20 TSSOP-EP
PACKAGE
CODE
U20ME+1
OUTLINE
NO.
21-0108
LAND
PATTERN NO.
90-0114
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