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LTC2236 Ver la hoja de datos (PDF) - Linear Technology

Número de pieza
componentes Descripción
fabricante
LTC2236
Linear
Linear Technology 
LTC2236 Datasheet PDF : 28 Pages
First Prev 21 22 23 24 25 26 27 28
PACKAGE DESCRIPTIO
LTC2238/LTC2237/LTC2236
UH Package
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1693)
5.50 ±0.05
4.10 ±0.05
3.45 ±0.05
(4 SIDES)
0.70 ±0.05
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
5.00 ± 0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
PACKAGE OUTLINE
0.75 ± 0.05
0.00 – 0.05
3.45 ± 0.10
(4-SIDES)
BOTTOM VIEW—EXPOSED PAD
0.23 TYP
R = 0.115
(4 SIDES)
TYP
31 32
0.40 ± 0.10
1
2
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.25 ± 0.05
0.50 BSC
(UH) QFN 0603
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
223876fa
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