LT3596IUHG Ver la hoja de datos (PDF) - Linear Technology
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LT3596IUHG Datasheet PDF : 22 Pages
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LT3596
Package Description
UHG Package
Variation: UHG52 (39)
52-Lead Plastic QFN (5mm × 8mm)
(Reference LTC DWG # 05-08-1846 Rev B)
44
5.50 p 0.05
46
4.10 p 0.05 48
50
51
6.40 REF
43 41 39 37 35 34 33 32 31 30 29 28 27
2.90 p0.05
5.90 p0.05
2
4 6 7 9 11 12 13 14 15 16 17
0.80 BSC
0.40 BSC
7.10 p 0.05
8.50 p 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
51 50 48 46 44
0.70 p 0.05
26
25
24
23
22 3.20 REF
21
20
19
18
PACKAGE
OUTLINE
0.20 p 0.05
2
4
6
7
9
11
12
13
14
15
16
17
20
5.00 p 0.10
PIN 1
TOP MARK
(SEE NOTE 6)
8.00 p 0.10
0.75 p 0.05
0.00 – 0.05
R = 0.10
TYP
44
43
43
R = 0.10
TYP
46 48
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 s 45o CHAMFER
50 51
0.40 p0.10
41
41
39
39
37
37
35
35
6.40 REF
34
34
33
33
32
32
31
31
30
30
29
29
28
28
27
27
5.90 p0.10
2.90 p0.10
2
4
6 0.20 p 0.05
7
0.80 BSC
9
11 0.60 TYP
12
13
0.40 BSC
14
15
16
17
0.75 p 0.05
0.200 REF
26 25 24 23 22 21 20 19 18
3.20 REF
BOTTOM VIEW—EXPOSED PAD
0.70 TYP
(UHG39) QFN 0410 REV B
18 19 20 21 22 23 24 25 26
0.00 – 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
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