IW4098B
MAXIMUM RATINGS*
Symbol
Parameter
VCC
VIN
VOUT
IIN
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
PD Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
PD Dissipation per Output Transistor
Tstg Storage Temperature
TL Lead Temperature, 1 mm from Case for 10
Seconds (Plastic DIP or SOIC Package)
Value
Unit
-0.5 to +20
V
-0.5 to VCC +0.5
V
-0.5 to VCC +0.5
V
±10
mA
750
mW
500
100
mW
-65 to +150
°C
260
°C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min Max Unit
VCC
DC Supply Voltage (Referenced to GND)
3.0
18
V
VIN, VOUT DC Input Voltage, Output Voltage (Referenced to GND) 0
VCC
V
TA
Operating Temperature, All Package Types
-55 +125 °C
This device contains protection circuitry to guard against damage due to high static voltages or
electric fields. However, precautions must be taken to avoid applications of any voltage higher than
maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be
constrained to the range GND≤(VIN or VOUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC).
Unused outputs must be left open.
Rev. 00