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HI-1565CDM Ver la hoja de datos (PDF) - Holt Integrated Circuits

Número de pieza
componentes Descripción
fabricante
HI-1565CDM
HOLTIC
Holt Integrated Circuits 
HI-1565CDM Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
PACKAGE DIMENSIONS
44-PIN PLASTIC CHIP-SCALE PACKAGE (QFN)
.276
(7.00)
BSC
.276
(7.00)
BSC
Top View
.216 ± .002
(5.50 ± .05)
inches (millimeters)
Package Type: 44PCS
.216 ± .002
(5.50 ± .05)
Bottom
View
.020
(0.50)
BSC
.010
(0.25)
typ
.039
(1.00)
max
.008
(0.2)
typ
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
Electrically isolated heat
sink pad on bottom of
package
Connect to any ground or
power plane for optimum
thermal dissipation
.016 ± .002
(0.40 ± .05)
HOLT INTEGRATED CIRCUITS
10

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