Electrical Characteristics
TJ = 25 °C unless otherwise noted
Symbol
VIN
VIL
VIH
IQ
IQ_off
ISD_off
IQ_off
(VON float)
RDS(ON)
CV-ON(INP)
ION(PULL-UP)
Parameter
Test Conditions
Operation Voltage
ON Input Logic Low Voltage
ON Input Logic High Voltage
Quiescent Current
Off Supply Current
Off Switch Current
Off Supply Current with ON pin
floating
On Resistance
ON Input Capacitance
ON Pull Up Current
VIN = 1.6V, Ramp down VON from 1V to 0V,
VOUT Low to High, TJ = -25 to 75 °C
VIN = 4V, Ramp down VON from 1V to 0V,
VOUT Low to High, TJ = -25 to 75 °C
VIN = 1.6V, Ramp up VON from 0V to 1V,
VOUT High to Low, TJ = -25 to 75 °C
VIN = 4V, Ramp up VON from 0V to 1V,
VOUT High to Low, TJ = -25 to 75 °C
VIN = 3V, VON = 0.35V, IOUT = 0A,
TJ = -25 to 75 °C
VIN = 3V, VON = 1.3V, IOUT = 0A,
TJ = -25 to 75 °C
VIN = 3V, VON = 1.3V, VOUT = 0V,
TJ = -25 to 75 °C
VIN = 3V, VON = floating, IOUT = 0A,
VIN = 3V, VON = floating, IOUT = 0A,
TJ = -25 to 75 °C
VIN = 1.6V, VON = 0V, IOUT = 300mA
VIN = 3V, VON = 0V, IOUT = 300mA
VIN = 3.6V, VON = 0V, IOUT = 300mA
VIN = 4V, VON = 0V, IOUT = 300mA, TJ = -25
to 75 °C
TJ = -25 to 75 °C
VIN = 3V, VON = 0V, TJ = -25 to 75 °C
Min
1.6
0.35
0.35
0.3
Typ
1.55
2.4
0.1
1.6
1.6
68
50
48
47
0.76
Max
4
1.35
1.35
2.5
6.5
3.5
2.3
4
120
90
85
80
5
1.2
Units
V
V
V
V
V
µA
µA
µA
µA
µA
m
pF
µA
Switching Characteristics
Ton
Tdon
Trise
Toff
Tdoff
Tfall
Turn on time (VON 50% to VOUT
90%)
Turn on delay time (VON 50% to
VOUT 10%)
Turn on rise time (VOUT 10% to
90%)
Turn off time (VON 50% to VOUT
10%)
Turn off delay time (VON 50% to
VOUT 90%)
Turn off fall time (VOUT 90% to
10%)
VIN=3V, VON = 0V as logic low and 1.3V as
logic high, COUT = 1nF, RL = 30Ω,
TJ = -25 to 75 °C
Tdon – Tdoff Turn on Turn off Delay Delta time
45 150
ns
35 100
ns
10 50
ns
60 150
ns
25 100
ns
35 65
ns
50
ns
Notes:
1.
RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is
defined as the solder mounting surface of the drain pins. RӨJC is guaranteed by design while RӨJA is determined by the
user’s board design.
2. Pulse Test: Pulse Width < 300μs, Duty Cycle < 2.0%.
© 2012 Fairchild Semiconductor Corporation
FDZ2040L Rev.B1
4
www.fairchildsemi.com