EMIF03-SIM03F3 Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
fabricante
EMIF03-SIM03F3 Datasheet PDF : 8 Pages
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Package information
3
Package information
EMIF03-SIM03F3
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 14. Package dimensions
400 µm ± 40
255 µm ± 40
605 µm ± 55
Figure 15. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening :
220 µm recommended
1.14 mm ± 30 µm
170 µm
Figure 16. Marking
Dot, ST logo
ECOPACK status
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
xxz
y ww
Figure 17. Flip-Chip tape and reel specification
Dot identifying Pin A1 location
2.0 ± 0.05
0.20 ± 0.02
4.0 ± 0.1
Ø 1.55 ± 0.1
0.69 ± 0.05
All dimensions in mm
1.24
4.0 ± 0.1
User direction of unreeling
6/8
Doc ID 16798 Rev 2
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