CY8C3865LTI-032(2011_03) Ver la hoja de datos (PDF) - Cypress Semiconductor

Número de pieza

componentes Descripción

fabricante

CY8C3865LTI-032
(Rev.:2011_03)

Programmable System-on-Chip (PSoC®)

Cypress Semiconductor 

PSoC® 3: CY8C38 Family

Data Sheet

13. Packaging

Table 13-1. Package Characteristics

Parameter

TA

TJ

Tja

Tja

Tja

Tja

Tjc

Tjc

Tjc

Tjc

Description

Operating ambient temperature

Operating junction temperature

Package θJA (48-pin SSOP)

Package θJA (48-pin QFN)

Package θJA (68-pin QFN)

Package θJA (100-pin TQFP)

Package θJC (48-pin SSOP)

Package θJC (48-pin QFN)

Package θJC (68-pin QFN)

Package θJC (100-pin TQFP)

Conditions

Table 13-2. Solder Reflow Peak Temperature

Package

48-pin SSOP

48-pin QFN

68-pin QFN

100-pin TQFP

Maximum Peak

Temperature

260 °C

260 °C

260 °C

260 °C

Maximum Time at Peak

Temperature

30 seconds

30 seconds

30 seconds

30 seconds

Table 13-3. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2

Package

48-pin SSOP

48-pin QFN

68-pin QFN

100-pin TQFP

MSL

MSL 3

MSL 3

MSL 3

MSL 3

Min

Typ

Max Units

–40

25.00

85

°C

–40

–

100

°C

–

45.16

– °C/Watt

–

15.94

– °C/Watt

–

11.72

– °C/Watt

–

30.52

– °C/Watt

–

27.84

– °C/Watt

–

7.05

– °C/Watt

–

6.32

– °C/Watt

–

9.04

– °C/Watt

Document Number: 001-11729 Rev. *R

Page 119 of 129

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