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Número de pieza

componentes Descripción

fabricante

BUJ303A
(Rev.:2011)

NPN power transistor

NXP Semiconductors. 

NXP Semiconductors

BUJ303A

NPN power transistor

5. Thermal characteristics

Table 5.

Symbol

Rth(j-mb)

Rth(j-a)

Thermal characteristics

Parameter

thermal resistance from junction to mounting

base

thermal resistance from junction to ambient

Conditions

see Figure 5

in free air

Min Typ Max Unit

-

-

1.25 K/W

-

60 -

K/W

10

Zth(j-mb)

(K/W)

1 δ = 0.5

0.2

0.1

0.05

10-1

0.02

0

003aag030

Ptot

tp

δ=

T

10-2

10-5

10-4

10-3

10-2

10-1

tp

t

T

1

10

tp (s)

Fig 5. Transient thermal impedance from junction to mounting base as a function of pulse width

BUJ303A

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 05 — 3 May 2011

© NXP B.V. 2011. All rights reserved.

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