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BA3259HFP Datasheet PDF : 19 Pages
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BA3259HFP BA30E00WHFP
●Block Diagrams / Standard Example Application Circuits / Pin Configurations / Pin Descriptions
Datasheet
Current
Limit
GND
FIN
Thermal
Shutdown
Current
Limit
VREF
VO1
5
3.3V
CO1
1μF
VO2
4
GND
3
1.5V
CO2
1μF
ADJ
2
Vcc
1
R2
R1
VIN
CIN
3.3μF
Reference
Voltage
Thermal
Shut Down
GND(Fin)
Vcc1
Vcc1
Current
Limit
Sat.
Prevention
Vcc2
Vcc2
Current
Limit
Sat.
Prevention
EN 1 Vcc2 2
1μF
Vcc1 3 GND 4 Vo1 5 Vo2 6 ADJ 7
1μF
47μF 47μF
R2 R1
Fig.1 BA3259HFP Block Diagram
Fig.2 BA30E00WHFP Block Diagram
Pin Pin
No. name
Function
1 VCC Power supply pin
2 ADJ Variable output voltage detection pin
3 GND GND pin
4 Vo2 Variable output pin
5 Vo1 3.3 V output pin
FIN GND GND pin
PIN
Vcc (1Pin)
Vo1 (5Pin)
Vo2 (4Pin)
External capacitor
setting range
Approximately 3.3µF
1 µF to 1000 µF
1 µF to 1000 µF
TOP VIEW
12345
HRP5
Pin Pin
No. name
Function
1 EN Output on/off control pin: High active
2 Vcc2 Power supply pin 2
3 Vcc1 Power supply pin 1
4 GND GND pin
5 Vo1 Power supply pin for 3.3 V output
6
Vo2
Variable output voltage detection pin
(0.8 V to 3.3 V)
7 ADJ Variable output voltage detection pin
FIN GND GND pin
PIN
Vcc1 (3Pin)
Vcc2 (2Pin)
Vo1 (5Pin)
Vo2 (6Pin)
External capacitor
setting range
Approximately 1 µF
Approximately 1 µF
47 µF to 1000 µF
47 µF to 1000 µF
TOP VIEW
1234567
HRP7
●Absolute Maximum Ratings
BA3259HFP
Parameter
Symbol
Ratings
BA30E00WHFP
Units
Parameter
Symbol
Applied voltage
Vcc
15 *1
V
Applied voltage
Vcc
Power dissipation
Pd
2300 *2
mW Power dissipation
Pd
Operating
temperature range
Topr
0 to 85
℃
Operating
temperature range
Topr
Ambient storage
temperature range
Tstg
−55 to 150
℃
Ambient storage
temperature range
Tstg
Maximum junction
temperature
Tjmax
150
℃
Maximum junction
temperature
Tjmax
*1 Must not exceed Pd.
*2 Derated at 18.4 mW/℃ at Ta>25℃ when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).
Ratings
18 *1
2300 *2
−25 to 105
−55 to 150
150
Units
V
mW
℃
℃
℃
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
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TSZ02201-0R6R0A600100-1-2
26.Jun.2012 Rev.001
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