ADCMP582(RevB) Ver la hoja de datos (PDF) - Analog Devices
Número de pieza
componentes Descripción
fabricante
ADCMP582 Datasheet PDF : 16 Pages
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Data Sheet
ADCMP580/ADCMP581/ADCMP582
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
TOP VIEW
0.50
BSC
0.30
0.23
0.18
13
12
16
1
EXPOSED
PAD
PIN 1
INDICATOR
1.45
1.30 SQ
1.15
9
4
0.50
8
5
0.25 MIN
0.40
BOTTOM VIEW
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
ORDERING GUIDE
Model1
ADCMP580BCPZ-WP
ADCMP580BCPZ-R2
ADCMP580BCPZ-RL7
ADCMP581BCPZ-WP
ADCMP581BCPZ-R2
ADCMP581BCPZ-RL7
ADCMP582BCPZ-WP
ADCMP582BCPZ-R2
ADCMP582BCPZ-RL7
EVAL-ADCMP580BCPZ
EVAL-ADCMP581BCPZ
EVAL-ADCMP582BCPZ
1 Z = RoHS Compliant Part.
COMPLIANT TO JEDEC STANDARDS MO-220-WEED.
Figure 29. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-16-21)
Dimensions shown in millimeters
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
16-Lead Lead Frame Chip Scale Package [LFCSP]
Evaluation Board
Evaluation Board
Evaluation Board
Package Option
CP-16-21
CP-16-21
CP-16-21
CP-16-21
CP-16-21
CP-16-21
CP-16-21
CP-16-21
CP-16-21
Branding
G12
G12
G12
G11
G11
G11
G10
G10
G10
Rev. B | Page 15 of 16
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