AD7879 Ver la hoja de datos (PDF) - Analog Devices
Número de pieza
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fabricante
AD7879 Datasheet PDF : 40 Pages
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AD7879/AD7889
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
0.65
BSC
0.35
0.30
0.25
13
12
16
1
EXPOSED
PAD
PIN 1
INDICATOR
*2.40
2.35 SQ
2.30
TOP VIEW
0.50
0.40
9
8
4
5
BOTTOM VIEW
0.25 MIN
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 REF
*COMPLIANT TO JEDEC STANDARDS MO-220-WGGC-3
WITH EXCEPTION TO THE EXPOSED PAD.
Figure 49. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm and 0.75 mm Package Height
(CP-16-20)
Dimensions shown in millimeters
Data Sheet
ORDERING GUIDE
Model1
AD7879ACBZ-RL
AD7879ACBZ-500R7
AD7879ACPZ-RL
AD7879ACPZ-500R7
AD7879-1ACBZ-RL
AD7879-1ACBZ-500R7
AD7879-1ACPZ-RL
AD7879-1ACPZ-500R7
AD7889ACBZ-RL
EVAL-AD7879EBZ
EVAL-AD7879-1EBZ
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Serial Interface Description
SPI Interface
SPI Interface
SPI Interface
SPI Interface
I2C Interface
I2C Interface
I2C Interface
I2C Interface
SPI Interface
SPI Interface
I2C Interface
Package Description
12-Ball WLCSP
12-Ball WLCSP
16-Lead LFCSP
16-Lead LFCSP
12-Ball WLCSP
12-Ball WLCSP
16-Lead LFCSP
16-Lead LFCSP
12-Ball, Backside-Coated WLCSP
Evaluation Board
Evaluation Board
Package
Option
CB-12-1
CB-12-1
CP-16-20
CP-16-20
CB-12-1
CB-12-1
CP-16-20
CP-16-20
CB-12-5
Branding
T2Y
T2Y
T0Q
T0Q
T3R
1 Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2008–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07667-0-8/16(D)
Rev. D | Page 40 of 40
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