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AD7714

3 V/5 V/ CMOS/ 500 uA Signal Conditioning ADC

Analog Devices 

AD7714

ABSOLUTE MAXIMUM RATINGS*

(TA = +25°C unless otherwise noted)

AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

AVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3␣ V to +7␣ V

DVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3␣ V to +7␣ V

DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3␣ V to +7␣ V

Analog Input Voltage to AGND . . . . . –0.3 V to AVDD + 0.3␣ V

Reference Input Voltage to AGND . . . –0.3 V to AVDD + 0.3␣ V

Digital Input Voltage to DGND . . . . . –0.3 V to DVDD + 0.3 V

Digital Output Voltage to DGND . . . . –0.3 V to DVDD + 0.3 V

Operating Temperature Range

Commercial (A Version) . . . . . . . . . . . . . . . –40°C to +85°C

Extended (Y Version) . . . . . . . . . . . . . . . . . –40°C to +105°C

Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C

Plastic DIP Package, Power Dissipation . . . . . . . . . . . 450 mW

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W

Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . +260°C

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 450 mW

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C

SSOP Package, Power Dissipation . . . . . . . . . . . . . . . . 450 mW

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 109°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C

TSSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 128°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although these devices feature proprietary ESD protection circuitry, permanent damage may still

occur on these devices if they are subjected to high energy electrostatic discharges. Therefore,

proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

PIN CONFIGURATIONS

DIP and SOIC/TSSOP

SSOP

SCLK

MCLK IN

MCLK OUT

POL

SYNC

RESET

AIN1

AIN2

AIN3

AIN4

STANDBY

AVDD

AD7714

TOP VIEW

(Not to Scale)

DGND

DVDD

DIN

DOUT

DRDY

CS

AGND

AIN6

AIN5

REF IN(+)

REF IN(–)

BUFFER

SCLK

MCLK IN

MCLK OUT

POL

SYNC

RESET

NC

NC

AIN1

AIN2

AIN3

AIN4

STANDBY

AVDD

AD7714

TOP VIEW

(Not to Scale)

DGND

DVDD

DIN

DOUT

DRDY

CS

NC

NC

AGND

AIN6

AIN5

REF IN(+)

REF IN(–)

BUFFER

NC = NO CONNECT

–8–

REV. C

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