HTU21P Ver la hoja de datos (PDF) - Unspecified

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HTU21P

Digital Relative Humidity sensor with Temperature output

Unspecified 

HTU21D(F) Sensor

Digital Relative Humidity sensor with Temperature output

HTU21D(F) sensor as a humidity sensitive component (as classified by IPC/JEDEC J-STD-020 or equivalent

documented procedure with peak temperature at 260°C during up to 30 seconds for Pb-free assembly in

IR/convection reflow ovens) must be handled in a manner consistent with IPC/JEDEC J-STD-033 or an

equivalent documented procedure. IPC-1601 provides humidity control, handling and packing of PCBs.

The HTU21D(F) s ensor is qualified to withstand one lead free reflow soldering recommended process profile

below according to JEDEC standard.

Mount parts within 24 hours after printing solder paste to avoid potential dry up.

For manual soldering, contact time must be limited to 5 seconds at up to 350°C.

For the design of the HTU21D(F) sensor footprint, it is recommended to use dimensions according to figure

below.

Recommended footprint for HTU21D(F) sensors. Values in mm.

No specific conditioning of devices is necessary after soldering process, either manual or reflow soldering.

Optimized performance in case of metrological measurements can be reached with stabilization of devices (24

hours at 25°C / 55%RH). Similar process is advised after exposure of the devices to extreme relative humidity

conditions.

In no case, neither after manual nor reflow soldering, a board wash shall be applied. Therefore, it is strongly

recommended to use a “no-clean” solder paste. In case of applications with exposure of the sensor to corrosive

gases or condensed water (i.e. environments with high relative humidity) the soldering pads shall be sealed

(e.g. conformal coating) to prevent loose contacts or short cuts.

HPC199_3 HTU21D(F) Sensor Datasheet

www.meas-spec.com

6/21

October 2013

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