NXP Semiconductors
10. Soldering
2PB709ART
45 V, 100 mA PNP general-purpose transistor
2.90
2.50
0.85
2
3.00 1.30
0.85
1
3
2.70
0.60
(3x)
1.00
3.30
0.50 (3x)
0.60 (3x)
sot023
Fig 8. Reflow soldering footprint SOT23 (TO-236AB)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
3.40
1.20 (2x)
4.60 4.00 1.20
2
1
3
solder lands
solder resist
occupied area
2.80
4.50
Dimensions in mm
preferred transport direction during soldering
sot023
Fig 9. Wave soldering footprint SOT23 (TO-236AB)
2PB709ART_1
Product data sheet
Rev. 01 — 19 March 2007
© NXP B.V. 2007. All rights reserved.
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