NXP Semiconductors
MF1S5009
Mainstream contactless smart card IC
3. Applications
Public transportation
Access management
Electronic toll collection
Car parking
School and campus cards
Employee cards
Internet cafés
Loyalty
4. Ordering information
Table 1. Ordering information
Type number
Package
Commerci Name
al Name
MF1S5009DUD FFC
-
MF1S5009DA4 MOA4
PLLMC
Description
Version
8 inch wafer, 120 μm thickness, on film -
frame carrier, electronic fail die
marking according to SECS-II format)
plastic leadless module carrier
package; 35 mm wide tape
SOT500-2
5. Block diagram
RF
INTERFACE
POWER ON
RESET
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
RESET
GENERATOR
UART
ISO/IEC
14443A
Fig 2. Block diagram
LOGIC UNIT
CRYPTO1
CRC
EEPROM
001aal732
MF1S5009
Product data sheet
PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 27 July 2010
189131
© NXP B.V. 2010. All rights reserved.
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