TGA9088A Ver la hoja de datos (PDF) - TriQuint Semiconductor
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TGA9088A Datasheet PDF : 4 Pages
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Advance Product Information
May 3, 2000
TGA9088A
Chip Assembly and Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
TriQuint Semiconductor Texas : Phone (972)994 8465 Fax (972)994 8504 Web: www.triquint.com
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