TMP87C408LM Ver la hoja de datos (PDF) - Toshiba
Número de pieza
componentes Descripción
fabricante
TMP87C408LM Datasheet PDF : 48 Pages
| |||
Quality and Reliability Assurance / Handling Precautions
4.5.3
Soldering Temperature Profile
The soldering temperature and heating time vary from device to device.
Therefore, when specifying the mounting conditions, refer to the individual
datasheets and databooks for the devices used.
(1) Using a Soldering Iron
Complete soldering within ten seconds for lead temperatures of up to
260°C, or within three seconds for lead temperatures up to 350°C.
(2) Standard Mounting Conditions for SMDs
(Surface Mount Devices)
For details, refer to section 2.1 Mounting Precautions in chapter 2
Handling Precautions for Microcontrollers.
030901
QUA-43
2002-02-20
Share Link: 