MT48LC16M16A2F4-7E Ver la hoja de datos (PDF) - Micron Technology

Número de pieza

componentes Descripción

fabricante

MT48LC16M16A2F4-7E

256Mb: x4, x8, x16 SDRAM

Micron Technology 

Figure 10: 54-Ball VFBGA "B4/F4" (8mm x 8mm) (x16)

256Mb: x4, x8, x16 SDRAM

Package Dimensions

54X Ø0.45

Dimensions apply

to solder balls post-

reflow on∅Ø0.40 SMD

ball pads.

987

6.4 CTR

8 ±0.1

0.8 TYP

A

Ball A1 ID

(covered by SR)

321

A

B

C

D

E

F

G

H

J

Seating plane

0.12 A

Ball A1 ID

0.8 TYP

0.9 ±0.1

6.4 CTR

0.25 MIN

8 ±0.1

Notes:

1. All dimensions are in millimeters.

2. Recommended pad size for PCB is 0.4mm ±0.065mm.

3. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or SAC105 (98.5% Sn, 1% Ag,

0.5% Cu).

4. Topside part-marking decoder is available at www.micron.com/decoder.

PDF: 09005aef8091e6d1

256Mb_sdr.pdf - Rev. S 12/12 EN

18

Micron Technology, Inc. reserves the right to change products or specifications without notice.

© 1999 Micron Technology, Inc. All rights reserved.

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