MCRF450/451/452/455
2.0 ELECTRICAL CHARACTERISTICS
TABLE 2-1: ABSOLUTE RATINGS
Parameters
Symbol
Min
Max
Units
Conditions
Coil current into coil pad
IPP_AC
—
40
mA Peak-to-Peak coil current
Maximum power dissipation
PMPD
—
0.5
W—
Ambient temperature with power applied TAMB
-40
+125
°C —
Assembly temperature
TASM
—
300
°C < 10 sec.
Storage temperature
TSTORE
-65
150
°C —
Note:
Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
TABLE 2-2:
OPERATING DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature = -20°C to +70°C
Parameters
Symbol Min
Typ
Max Units
Conditions
Reading voltage
VDDR
2.8
—
—
V VDD voltage for reading at 25°C
Operating current in
IOPER_N
—
20
—
Normal mode
µA VDD = 2.8V during reading at 25°C
Operating current in
IOPER_F
—
45
—
Fast mode
µA VDD = 2.8V during reading at 25°C
Writing current
IWRITE
—
130
—
µA At 25°C, VDD = 2.8V
Writing voltage
VWRITE
2.8
—
—
VDC At 25 °C
Modulation resistance
RM
—
3.0
5.0
Ω DC turn-on resistance between
Drain and Source terminals of the
modulation transistor at VDD = 2.8V
Data retention
—
200
—
—
Years For T < 120°C
Endurance
—
1.0
—
—
Million At 25°C
Cycles
2003 Microchip Technology Inc.
DS40232H-page 5