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AD7851 Datasheet PDF : 36 Pages
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AD7851
ABSOLUTE MAXIMUM RATINGS1
(TA = 25°C, unless otherwise noted.)
AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Analog Input Voltage to AGND . . . . . –0.3 V to AVDD + 0.3 V
Digital Input Voltage to DGND . . . . –0.3 V to DVDD + 0.3 V
Digital Output Voltage to DGND . . . –0.3 V to DVDD + 0.3 V
REFIN/REFOUT to AGND . . . . . . . . . . –0.3 V to AVDD + 0.3 V
Input Current to Any Pin Except Supplies2 . . . . . . . . . ± 10 mA
Operating Temperature Range
Commercial (A, K Versions) . . . . . . . . . . . –40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
PDIP Package, Power Dissipation . . . . . . . . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 34.7°C/W
Lead Temperature, (Soldering, 10 secs) . . . . . . . . . . 260°C
SOIC, SSOP Package, Power Dissipation . . . . . . . . . 450 mW
θJA Thermal Impedance . . 75°C/W (SOIC), 122.28°C/W (SSOP)
θJC Thermal Impedance . . . 25°C/W (SOIC), 31.25°C/W (SSOP)
Lead Temperature, Soldering
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >1.5 kV
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Transient currents of up to 100 mA will not cause SCR latch-up.
PINOUT FOR DIP, SOIC, AND SSOP
CONVST 1
24 SYNC
BUSY 2
SLEEP 3
23 SCLK
22 CLKIN
REFIN/REFOUT 4
AVDD 5
AGND 6
CREF1 7
CREF2 8
AIN(+) 9
21 DIN
AD7851
TOP VIEW
(Not to Scale)
20 DOUT
19 DGND
18 DVDD
17 CAL
16 SM2
AIN(–) 10
15 SM1
NC 11
14 POLARITY
AGND 12
13 AMODE
ORDERING GUIDE1
NC = NO CONNECT
Model
Temperature
Range
Linearity
Error Throughput
(LSB)2 Rate (kSPS)
Throughput
at 125؇C (kSPS) Description
Package
Options3
AD7851AN
–40°C to +85°C ± 2
333
238
AD7851KN
0°C to 85°C
±1
285
238
AD7851AR
–40°C to +85°C ± 2
333
238
AD7851AR-REEL
–40°C to +85°C ± 2
333
238
AD7851ARZ3
–40°C to +85°C ± 2
333
238
AD7851ARZ-REEL3
–40°C to +85°C ± 2
333
238
AD7851KR
0°C to 85°C
±1
285
238
AD7851KR-REEL
0°C to 85°C
±1
285
238
AD7851KRZ3
0°C to 85°C
±1
285
238
AD7851KRZ-REEL3
0°C to 85°C
±1
285
238
AD7851ARS
–40°C to +85°C ± 2
333
238
AD7851ARS-REEL
–40°C to +85°C ± 2
333
238
EVAL-AD7851CB4
EVAL-CONTROL BRD25
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SSOP
SSOP
Evaluation Board
Controller Board
N-24
N-24
R-24
R-24
R-24
R-24
R-24
R-24
R-24
R-24
RS-24
RS-24
NOTES
1Both A and K Grades are guaranteed up to 125°C, but at a lower throughput of 238 kHz (5 MHz).
2Linearity error refers to the integral linearity error.
3Z = Pb-free part.
4This can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BOARD for evaluation/demonstration purposes.
5This board is a complete unit allowing a PC to control and communicate with all Analog Devices, Inc. evaluation boards ending in the CB designators. To order a
complete evaluation kit, the particular ADC evaluation board needs to be ordered, e.g., EVAL-AD7851CB, the EVAL-CONTROL BRD2, and a 12 V ac trans-
former. See the Evaluation Board application note for more information.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD7851 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. B
–7–

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