ADSP-21060(RevH) Ver la hoja de datos (PDF) - Analog Devices
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ADSP-21060 Datasheet PDF : 64 Pages
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ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC
ENVIRONMENTAL CONDITIONS
The ADSP-2106x processors are rated for performance under
TCASE environmental conditions specified in the Operating Con-
ditions (5 V) on Page 15 and Operating Conditions (3.3 V) on
Page 18.
Thermal Characteristics for MQFP_PQ4 and PBGA
Packages
The ADSP-21060/ADSP-21060L and ADSP-21062/ADSP-
21062L are available in 240-lead thermally enhanced
MQFP_PQ4 and 225-ball plastic ball grid array packages. The
top surface of the thermally enhanced MQFP_PQ4 contains a
metal slug from which most of the die heat is dissipated. The
slug is flush with the top surface of the package. Note that the
metal slug is internally connected to GND through the device
substrate.
Both packages are specified for a case temperature (TCASE). To
ensure that the TCASE is not exceeded, a heatsink and/or an air-
flow source may be used. A heatsink should be attached with a
thermal adhesive.
TCASE = TAMB + (PD CA)
TCASE = Case temperature (measured on top surface of package)
TAMB = Ambient temperature C
PD =Power dissipation in W (this value depends upon the spe-
cific application; a method for calculating PD is shown under
Power Dissipation).
CA =Values from Table 37 and Table 38 below.
Table 37. Thermal Characteristics for Thermally Enhanced
240-Lead MQFP_PQ41
Parameter Airflow (LFM2)
Typical Unit
CA
0
CA
100
CA
200
CA
400
CA
600
10
°C/W
9
°C/W
8
°C/W
7
°C/W
6
°C/W
1 This represents thermal resistance at total power of 5 W. With airflow, no
variance is seen in CA at 5 W.
CA at 0 LFM varies with power:
at 2 W, CA = 14°C/W
at 3 W, CA = 11°C/W
2 LFM = Linear feet per minute of airflow.
Table 38. Thermal Characteristics for BGA
Parameter Airflow (LFM1)
CA
0
CA
200
CA
400
1 LFM = Linear feet per minute of airflow.
Typical
20.70
15.30
12.90
Unit
°C/W
°C/W
°C/W
Thermal Characteristics for CQFP Package
The ADSP-21060C/ADSP-21060LC are available in 240-lead
thermally enhanced ceramic QFP (CQFP). There are two pack-
age versions, one with a copper/tungsten heat slug on top of the
package (CZ) for air cooling, and one with the heat slug on the
bottom (CW) for cooling through the board. The ADSP-2106x
is specified for a case temperature (TCASE). To ensure that the
TCASE data sheet specification is not exceeded, a heatsink and/or
an air flow source may be used. A heatsink should be attached
with a thermal adhesive.
TCASE = TAMB + (PD CA)
TCASE = Case temperature (measured on top surface of package)
TAMB = Ambient temperature C
PD = Power dissipation in W (this value depends upon the spe-
cific application; a method for calculating PD is shown under
Power Dissipation).
CA =Value from Table 39 below.
Table 39. Thermal Characteristics for Thermally Enhanced
240-Lead CQFP1
Parameter Airflow (LFM2)
Typical Unit
ADSP-21060CW/ADSP-21060LCW
CA
0
CA
100
CA
200
CA
400
CA
600
ADSP-21060CZ/ADSP-21060LCZ
19.5
°C/W
16
°C/W
14
°C/W
12
°C/W
10
°C/W
CA
0
20
°C/W
CA
100
16
°C/W
CA
200
14
°C/W
CA
400
11.5
°C/W
CA
600
9.5
°C/W
1 This represents thermal resistance at total power of 5 W. With airflow, no
variance is seen in CA at 5W.
CA at 0 LFM varies with power.
ADSP-21060CW/ADSP-21060LCW:
at 2 W, CA = 23°C/W
at 3 W, CA = 21.5°C/W
ADSP-21060CZ/ADSP-21060LCZ:
at 2 W, CA = 24°C/W
at 3 W, CA = 21.5°C/W
JC = 0.24°C/W for all CQFP models.
2 LFM = Linear feet per minute of airflow.
Rev. H | Page 51 of 64 | March 2013
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