GS880F18T-11.5 Ver la hoja de datos (PDF) - Giga Semiconductor

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GS880F18T-11.5

512K x 18, 256K x 36 8Mb Sync Burst SRAMs

Giga Semiconductor 

TQFP Package Drawing

Symbol Description Min. Nom. Max

A1

Standoff

0.05 0.10 0.15

A2

Body Thickness 1.35 1.40 1.45

b

Lead Width

0.20 0.30 0.40

c

Lead Thickness 0.09

0.20

D

Terminal Dimension 21.9 22.0 22.1

D1

Package Body 19.9 20.0 20.1

E

Terminal Dimension 15.9 16.0 16.1

E1

Package Body 13.9 14.0 14.1

e

Lead Pitch

0.65

L

Foot Length

0.45 0.60 0.75

L1

Lead Length

1.00

Y

Coplanarity

0.10

θ

Lead Angle

0°

7°

Notes:

1. All dimensions are in millimeters (mm).

2. Package width and length do not include mold protrusion

θ

L

L1

c

e

b

A1

A2

Preliminary

GS880F18/36T-10/11/11.5/12/14

E1

E

BPR 1999.05.18

Rev: 1.03 3/2000

23/25

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

© 2000, Giga Semiconductor, Inc.

N

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