Packaging
5 Packaging
Freescale Semiconductor, Inc.
-A-
16
1
H
G
9
B
8
F
C
S
-T-
SEATING
PLANE
K
J
D 16 PL
0.25 (0.010) M T A M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
L
M
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC
2.54 BSC
H 0.050 BSC
1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M
0_ 10_
0_ 10_
S 0.020 0.040 0.51 1.01
Figure 35. Outline Dimensions for P Suffix, DIP-16
(Case 648-08, Issue R)
PIN'S
NUMBER
1
PIN 1 INDEX
0.25 M B
6.2
8X 5.8
16
A
1.75
1.35
10.0
4 9.8
A
A
8
9
4.0
3.8
B
5
0.50 X45°
0.25
0.25
0.10
16X
0.49
0.35
6
0.25 M T A B
14X
1.27
T
SEATING
PLANE
16X
0.1 T
0.25
0.19
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. DATUMS A AND B TO BE DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC
BODY.
4. THIS DIMENSION DOES NOT INCLUDE MOLD FLASH,
PROTRUSION OR GATE BURRS, MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 MM PER SIDE. THIS DIMENSION IS DETERMINED AT
THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
5. THIS DIMENSION DOES NOT INCLUDE INTER-LEAD FLASH
OR PROTRUSIONS. INTER-LEAD FLASH AND
PROTRUSIONS SHALL NOT EXCEED 0.25 MM PER SIDE.
THIS DIMENSION IS DETERMINED AT THE PLANE WHERE
THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY.
6. THIS DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.62 MM.
1.25
0.40
7°
0°
SECTION A-A
Figure 36. Outline Dimensions for D Suffix, SOG-16
(Case 751B-05, Issue J)
30
MC145170-2 Technical Data
MOTOROLA
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