CLP30-200B1(1999) Ver la hoja de datos (PDF) - STMicroelectronics
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fabricante
CLP30-200B1 Datasheet PDF : 11 Pages
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Pin
1
2/3/6/7
4
5
8
Symbol
TIPL
GND
RINGL
RINGS
TIPS
CLP30-200B1
Description
TIP (Line side)
Ground
RING (Line side)
RING (SLIC side)
TIP (SLIC side)
APPLICATION NOTE
1.INTRODUCTION
The aim of this section is to show the behavior of
our new telecom line protection device.
Fig.1 : Suscriber line protection topology
telecommunication
line
"PRIMARY PROTECTION"
MDF
"SECONDARY PROTECTION"
CLP30-
200B1
VOLTAGE
REFERENCE
LINE CARD
EXCHANGE
SLIC
Figure 1 is a simplified block diagram of a
subscriber line protection that is mainly used so
far.
This shows two different things :
s A “primary protection” located on the Main Dis-
tribution Frame (MDF) eliminates coarsely the
high energy environmental disturbances (light-
ning transients and AC power mains distur-
bances) for which the ITU-T-K20 requires a 4kV
10/700 µs test. This can be assumed either by
gas-tubes or silicon protection such as the
TLPxxM.
s A “secondary protection” located on the line
card eliminates finely the remaining transients
that have not been totally suppressed by the
first stage. The ITU-T-K20 requires a 1 kV
10/700 µs test. At this stage, the protection is
managed by the CLP30-200B1.
2. STMicroelectronics CLP30-200B1 CONCEPT
2.1 Evolution of the SLIC protection
Over the years, the performances of the SLICs
considerably increased and therefore the need of
the protection has also evolved.
The CLP30-200B1 is especially designed for the
protection of this new generation of SLIC. For this,
it is based on both overvoltage and overcurrent
protection modes.
Fig.2 : Line card protection
Programmable thanks to
any external voltage reference
- VSWON
I
+ I SWON
Programmable thanks to
an external resistor
- I SWON
V
+ VSWON
Line Card operating conditions
The figure 2 summarises the performance of the
CLP30-200B1 which basically holds the SLIC
inside its correct voltage and current values.
3/11
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