Manufacturer
Part Name
Description
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MITSUBISHI ELECTRIC
VOLTAGE COMPARATOR
Molex Connectors
3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 12 Circuits
Molex Connectors
10.00mm Pitch Mini-Fit Sr. Header, Dual Row, Vertical, 2.36mm PCB Thickness, 0.76µm Gold (Au) Selective Plating, 6 Circuits
Molex Connectors
10.00mm (.394") Pitch Mini-Fit Sr.™ Header, Dual Row, Vertical, 6 Circuits
Unspecified
(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED
Unspecified
(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED
Unspecified
(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED
Unspecified
(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED
Unspecified
(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED
Unspecified
(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED
Unspecified
(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED
Unspecified
(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED
Unspecified
(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED
Micron Technology
DDR3 SDRAM
Amphenol Aerospace
High reliability, solid state silicon pressure sensors
Unspecified
Carbon Composition Molded OD/OF Series (5 Tol.) OA Series (10%)
Unspecified
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
Make-Ps
Single & Dual Output DC/DC Converter
Unspecified
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
Amphenol Aerospace
High reliability, solid state silicon pressure sensors
Make-Ps
Single & Dual Output DC/DC Converter
Unspecified
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
Intersil
8-Channel TFT-LCD Reference Voltage Generator