Features
✧ Designed for mounting on small surface
✧ Extremely thin/leadless package
✧ Low capacitance
✧ Low forward voltage drop
✧ High temperature soldering:
   260°C/10 seconds at terminals
✧ Chip version in 0603

Mechanical Data
✧ Case: 0603 Standard package, molded plastic
✧ Terminals: Gold plated, solderable per
   MIL-STD-750, method 2026.
✧ Polarity: Indicated by cathode band
✧ Mounting position: Any
✧ Package code: BB
✧ Weight: 0.003 gram (approximately)