Part Name
TPSMC10
Other PDF
PDF
page
4 Pages
File Size
59.3 kB
MFG CO.

General Semiconductor
FEATURES
♦ Designed for under the hood surface mount applications
♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0
♦ Easy pick and place
♦ Low profile package
♦ Built-in strain relief
♦ Ideal for automated placement
♦ Exclusive patented PAR™ oxide passivated chip construction
♦ 1500W peak pulse power capability with a 10/1000µs waveform, repetition rate (duty cycle): 0.01%
♦ Excellent clamping capability
♦ Low incremental surge resistance
♦ Fast response time: typically less than 1.0ps from 0 Volts to V(BR)
♦ For devices with V(BR)≥10V ID are typically less than 1.0µA at TA=150°C
♦ High temperature soldering: 250°C/10 seconds at terminals