TG1-4271J Datasheet - Microsemi Corporation
MFG CO.

Microsemi Corporation
DESCRIPTION
The TG1/8 thermistor is encapsulated in a glass, hermetically sealed package. The TM1/8 and TM1/4 thermistors are encapsulated in a molded package. Both have hot solder-dipped leads and are used in temperature sensing and compensation circuits.
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