Description
The micromodule T5551 is the standard package for TEMIC Semiconductors’ contactless identification IC family. This package simplifies the soldering or welding handling and enables smart card applications. The micromodule is 400 µm thin, thus opening the way to contactless card applications. The module includes the IC e5551 and an internal 435 pF capacitor.

FEATUREs
Universal metal leadframe packaging for all identification applications, especially for contactless cards and small coins
Optimized mechanical stability
With internal 435 pF capacitor
Designed for high volumes
Overall thickness 400 µm